Report: Apple to Debut In-House Bluetooth/Wi-Fi Chip in iPhones and Smart Home Products in 2025

Apple is reportedly developing its own Bluetooth and WiFi chip that will make its debut on upcoming iPhone, HomePod, and Apple TV models coming next year. The information once again comes from Bloomberg’s Mark Gurman, who also recently shared details about Apple’s first cellular modem expected to ship on the fourth-gen iPhone SE in Spring 2025.

According to Gurman, Apple’s in-house Bluetooth/Wi-Fi is codenamed “Proxima.” It has been in development for several years, and it will be manufactured by TSMC. It will replace Broadcom wireless chips in the company’s various products, though that won’t be the end of the relationship between the two companies: Gurman reported that Apple will continue to use Broadcom’s radio frequency filter for modems in its products, and a separate report from The Information also revealed earlier this week that the two companies were working on a new AI chip to be used in servers.

“Apple’s goal is to develop an end-to-end wireless approach that is tightly integrated with its other components and more energy-efficient,” sources familiar with the project told Gurman. “With a homegrown wireless chip in Apple’s smart home devices, the products will work more closely together and potentially synchronize data more quickly,” the reporter added.

The new Proxima chip is expected to launch first on upcoming revisions of the Apple TV and the HomePod Mini. Gurman believes that the new chip will also come to new iPhone models later in 2025, with iPads and Macs to follow in 2026.

Apple already has some experience designing wireless components with its H-Series chips for AirPods and W-Series chips used in Apple Watches. Ultimately, Apple’s push for more vertical integration may help the company to create thinner, more power-efficient mobile devices. However, companies like Broadcom and Qualcomm have decades of experience in designing wireless chips, and Apple’s first in-house efforts may probably not match the performance of these third-party components.