With new CEO Pat Gelsinger now firmly in charge, Intel has delivered a new product roadmap for the next several years.
“Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” Mr. Gelsinger said during the firm’s Intel Accelerated webcast yesterday. “We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore’s Law and our path to innovate with the magic of silicon.”
As part of the new roadmap, Intel also introduced a new naming convention for its process nodes, which have recently stopped mapping directly to the manufacturing processes used by its competitors. So instead of using nanometer-based process node naming, as in the past—7 nm, 10 nm, and so on—Intel is instead naming its coming nodes based on how they match up with the competition.
The current 10 nm node process, which uses SuperFin remains unchanged, but the next-generation node process, previously called Enhanced SuperFin and currently in production, will now be called Intel 7. After that, the first true 7 nm Intel node process will be called Intel 4 and is due in 2022, and then the firm will ship Intel 3 and Intel 20A processes in 2023 and 2024, respectively.
That Intel 20A architecture is apparently the big leap here. Dubbed by the company the “angstrom era of semiconductors,” 20A will be Intel’s first new transistor architecture since 2011. And Qualcomm has already signed on to use Intel’s 20A process technology in future chipsets.
Beyond that, Intel plans an 18A architecture for early 2025 that will deliver “another major jump in transistor performance.”
Tagged with Intel