Mobile microprocessor giant Qualcomm today announced its Snapdragon 865, which lacks 5G, and 765, which has integrated 5G.
“5G will open new and exciting opportunities to connect, compute, and communicate in ways we’ve yet to imagine and we are happy to be a key player driving the adoption of 5G around the world,” Qualcomm president Cristiano Amon said in a prepared statement. “Our Snapdragon 5G mobile platforms announced today will continue to show leadership in the industry and deliver on the promise of scaling 5G in 2020.”
Qualcomm’s 2020 roadmap for 5G in mobile devices is, perhaps, a bit surprising. Its flagship mobile chipset, the Snapdragon 865, will not ship with integrated 5G capabilities and will instead rely on an extern modem. But its mid-level Snapdragon 765 will included integrated 5G.
Qualcomm says that the 865 will utilize its Snapdragon X55 Modem-RF System, which it described as “the world’s most advanced, global 5G platform.” The firm expects the Snapdragon 865 and 765 to power the most advanced Android-based smartphones launching in 2020, regardless of whether their users will be using 4G or 5G networking.
Qualcomm also announced 3D Sonic Max, the latest version of its ultrasonic fingerprint sensor for mobile devices. 3D Sonic Max provides a recognition area that is 17 times larger than with the previous generation, which allows for better security via simultaneous two-finger authentication, increased speed, and ease of use, the firm says.